1
|
COMPOSITE COPPER CLAD MATERIAL (100 SHEETS) / CONSISTING+EPOXY+GLASS CLOTH, GRADE: 22F WHITE, PZ WITH LOGO, 35 MICRON
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
LAIZHOU PENGZHOU ELECTRONICS CO., LTD
|
2024-03-22
|
CHINA
|
100.00 PCS
|
2
|
COMPOSITE COPPER CLAD MATERIAL (5250 SHEETS) / CONSISTING+EPOXY+GLASS CLOTH, GRADE: 22F WHITE, PZ WITH LOGO, 35 MICRON
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
LAIZHOU PENGZHOU ELECTRONICS CO., LTD
|
2024-03-22
|
CHINA
|
5250.00 PCS
|
3
|
SOLDER RESIST (UN3077) PLAS FINE PSR-310 (A-99F) 200PS (SCREEN PRINTING INKS)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
GOO CHEMICAL CO., LTD
|
2024-03-09
|
JAPAN
|
1000.00 KGS
|
4
|
MARKING INK (UN3077) PLAS FINE PSR-310 (W-107) 250PS (SCREENPRINTING INKS)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
GOO CHEMICAL CO., LTD
|
2024-03-09
|
JAPAN
|
20.00 KGS
|
5
|
MARKING INK (UN3077) PLAS FINE PSR-310 (C-24) 200PS (SCREENPRINTING INKS)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
GOO CHEMICAL CO., LTD
|
2024-03-09
|
JAPAN
|
185.00 KGS
|
6
|
ETCHING RESIST PLAS FINE PER-27B-6K (170PS) (SCREEN PRINTINGINKS)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
GOO CHEMICAL CO., LTD
|
2024-03-09
|
JAPAN
|
500.00 KGS
|
7
|
LACQUERS-AUXILARY PREPARATION FOR SOLDERING (GLICOAT SMD EX) (600 LITERS)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
TAIYO INK INTERNATIONAL (S) PTE LTD
|
2024-02-26
|
JAPAN
|
600.00 KGS
|
8
|
UVR-150G LE10CW (2 LAYER TYPE) VISCOSITY 200PS (SCREEN PRINTING INK)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
TAIYO INK INTERNATIONAL (S) PTE LTD
|
2024-02-23
|
KOREA,REPUBLIC OF
|
400.00 KGS
|
9
|
UVR-150G LE10P (2 LAYER TYPE) VISCOSITY 125PS (SCREEN PRINTING INK)
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
TAIYO INK INTERNATIONAL (S) PTE LTD
|
2024-02-23
|
KOREA,REPUBLIC OF
|
350.00 KGS
|
10
|
COMPOSITE COPPER CLAD MATERIAL (5000 SHEETS) / CONSISTING OFPAPER+EPOXY+GLASS CLOTH, GRADE: 22F WHITE, PZ WITH LOGO, 35
|
MULTILINE ELECTRONICS PRIVATE LIMITED
|
LAIZHOU PENGZHOU ELECTRONICS CO., LTD
|
2024-02-23
|
CHINA
|
5000.00 PCS
|